|
|
 |
 PCB
FABRICATION:
--FR4, FR5, CEM1 & CEM3, Roger, Isola, Polyimide,
Teflon
--Single, Multilayer to 22 layers
--Blind & Buried, HDI, Laser Drill
--HASL lead-free, OSP, Immersion Gold, Flash Gold
ASSEMBLY:
--SMT Pick & Place
--Through Hole Assembly
--AOI Inspection
--ICT Testing
PROTOTYPE SERVICE:
--Via-in-pad, Stacked Hole, IVH, Build-up, Laser Drill
--Burn In, Ultra Thin, High Density, Back Plane
--Controlled Impedance
--BGA, Micro BGA Assembly
--X-Ray Quality Inspection
--24 hours delivery (depend on specification provided) |
|
|
|
